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Polyimide foam aerogel

PI foam is synthesized into PI aerogel by supercritical process. The product retains the excellent performance of PI foam, and the thermal conductivity is greatly reduced.

PIA is a three-dimensional cross-linked porous material composed of polymer molecular chains. Combined with the excellent performance of PI and aerogel, PIA not only has the excellent characteristics of PI, but also has the outstanding characteristics of aerogel, such as lightweight, ultra-low density, high specific surface area, low thermal conductivity, low impedance, environmental durability and low dielectric constant. These special properties make PIA materials have excellent application prospects in thermal, electrical, mechanics, acoustics and other fields.

    Polyimide foam aerogel advantages

    Low thermal conductivity        Thermal conductivity ≤0.018

    High temperature resistance, high temperature stability       Long-term working temperature 300℃, thermal decomposition temperature 550℃

    Hydrophobic rate is greater than 98%    Long-term use, will not absorb oil smoke stains

    Good weather resistance    Good acid, alkali and oil resistance

    VOC is 0    At 300℃, no volatile gas is released.

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    E-cigarette heat insulation sleeve integrated molding scheme
    1, the installation process is simplified, production efficiency and product installation consistency is high.
    2, eliminate the heat leakage problem at the joint of the winding process, and further improve the heat insulation and thermal stability.
    3, no glue bonding, eliminate the high-temperature volatile odor of glue, while taking into account the tight coating.

    Certificate

    1 (1)8f8

    Halogen-free Report

    1 (5)s2q

    ROSH Report

    1 (2)brn

    Moisture Absorption Rate Report

    1 (6)ygi

    Thermal Weight Loss Report

    1 (3)119

    Flame Retardancy Report

    1 (7)5ci

    Thermal Resistance Report

    1 (8)7gh

    Residual Solvent Report

    1 (4)nyy

    REACH Report

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